Wafer Inspection & Metrology Equipment market is estimated at US$10 billion and growing through constant innovation
With input and cooperation from major semiconductor manufacturers, XwinSys has developed a new and unique approach to handling metrology inspection systems for the semiconductor and related industries. XwinSys’s Onyx is a unique hybrid technology for wafer inspection that combines ED-XRF and automated 3D vision technologies to provide material composition and 3D topography mapping. In May 2016, XwinSys was granted a US patent on this new technology. XwinSys is currently working with several of the largest global semiconductor companies to place units.
Integrated X-Ray and optical 3D analysis is a new approach to meet the challenges of roadmap requirements for inspection and metrology of 3D structures in the semiconductor industry. Onyx provides an in-line, non-destructive metrologic tool that has both inspection and metrology features and capabilities which overcome the limitations of entrenched technologies for measuring thin and ultra-thin films, provides superior performance for a wide variety of semiconductor applications.
On May 10, 2016, XwinSys was granted a patent from the United States Patent and Trademark Office for its patent application # 14/234,169 made in 2014 covering a method and a system for inspection of voids in a bump. This process patent protects XwinSys ONYX and AGATE systems which are non-destructive in-line metrology systems designed to handle the 3D-IC current and future challenges using the advent of X-Ray Technology for semiconductor metrology. These systems with their hybrid configuration of X-Ray analysis, automated 3D microscope and 2D image processing enable both inspection and metrology capabilities, along with small-scale material composition and 3D structure analysis.
3D-IC is the fastest growing segment of the semiconductor market and leads the way to vertical stacking that is evolving as the disruptive force of the industry. XwinSys is ideally positioned to supply unique analytical solutions to critical needs in this newly emerging field of 3D integrated circuit stacks.
Click to access the Hybrid Technology abstract from the July 2016 edition of Solid State Technology
Click to access the NMT Technology write-up from the February 2016 edition of Solid State Technology
Download the July 2016 edition of Solid State Technology
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XwinSys Company Overview
January 2017 (PDF)
Introducing the Onyx System
Download our most recent Onyx technology overview - Full metrology solution for measuring copper pillar bumps in as fast as 5 seconds
The Onyx System from XwinSys provides in-line, non-destructive, inspection and metrology for the semiconductor and micro electronics industries.
XwinSys 100SDD
Wafer Bump Inspection System High Speed High Accuracy 2D, 3D and ED-XRF
Specifications:
- 3D stereoscopic triangulation for accurate bump dimension measurement
- Up to 300 mm (12") wafers
- Bump Height, position and volume measurement
- Bumps Co- planarity measurement for each die
- Solder, Gold and Copper bumps
- DXRF for material combination analyzing
For additional information, visit the XwinSys website.
