Test and Measurement Innovators Focused on Key Growth Markets
Xenemetrix, winner of the Frost & Sullivan awards - 2010 and 2015
Strong Balance Sheet and Partners
Innovators in Taking the Laboratory to the Field
XwinSys has developed a new and unique approach to handling metrology inspection systems for the semiconductor and related industries
XwinSys’s Onyx is a unique hybrid technology for wafer inspection that combines ED-XRF and automated 3D vision technologies to provide material composition and 3D topography mapping. In May 2016, XwinSys was granted a US patent on this new technology. XwinSys is currently working with several of the largest global semiconductor companies to place units.
Integrated X-Ray and optical 3D analysis is a new approach to meet the challenges of roadmap requirements for inspection and metrology of 3D structures in the semiconductor industry. Onyx provides an in-line, non-destructive metrologic tool that has both inspection and metrology features and capabilities which overcome the limitations of entrenched technologies for measuring thin and ultra-thin films, provides superior performance for a wide variety of semiconductor applications.
On May 10, 2016, XwinSys was granted a patent from the United States Patent and Trademark Office for its patent application # 14/234,169 made in 2014 covering a method and a system for inspection of voids in a bump. This process patent protects XwinSys ONYX and AGATE systems which are non-destructive in-line metrology systems designed to handle the 3D-IC current and future challenges using the advent of X-Ray Technology for semiconductor metrology. These systems with their hybrid configuration of X-Ray analysis, automated 3D microscope and 2D image processing enable both inspection and metrology capabilities, along with small-scale material composition and 3D structure analysis.
3D-IC is the fastest growing segment of the semiconductor market and leads the way to vertical stacking that is evolving as the disruptive force of the industry. XwinSys is ideally positioned to supply unique analytical solutions to critical needs in this newly emerging field of 3D integrated circuit stacks.